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Introduction to high frequency circuit board

    • 629 posts
    January 8, 2021 1:29 PM EET

    The high-frequency circuit board is a special circuit board with a high electromagnetic frequency. Generally, the high frequency can be defined as a frequency above 1 GHz. Its physical properties, precision, and technical parameters are very high, and it is often used in automotive anti-collision systems, satellite systems, radio systems and other fields.To get more news about Halogen Free PCB, you can visit pcbmake official website.

    The high-frequency circuit board provided by the utility model is provided with a rib-blocking rib at the upper opening and the lower opening edge of the hollow groove of the core board, so that the core board and the upper surface and the lower surface are covered. When the copper plate is bonded, the flow glue does not enter the hollow groove, that is, the bonding operation can be completed by one press-fitting, and the high-frequency circuit board which can be completed by the secondary pressing in the prior art, the high-frequency circuit in the utility model The board has a simple structure, low cost and is easy to manufacture.

    PCB design high frequency circuit board wiring skills

    1. The less the lead between the high-speed electronic device pins is bent, the better.

    The lead wire of the high-frequency circuit wiring is preferably a full line, which needs to be turned, and can be folded by a 45-degree line or a circular arc. This requirement is only used to improve the fixing strength of the copper foil in the low-frequency circuit, and in the high-frequency circuit, the content is satisfied. One requirement is to reduce the external transmission and mutual coupling of high frequency signals.

    Second, the high frequency circuit device between the pin layers alternately less as possible

    The so-called “the least alternating between the layers of the leads is better” means that the fewer vias (Via) used in the component connection process, the better. A via can bring about a distributed capacitance of about 0.5pF, and reducing the number of vias can significantly increase speed and reduce the possibility of data errors.